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The technology to produce a kind of alternative to polyimide as a multi-layer electronic circuit Insulated Material - poly naphthalene fluorinated ether (FPNE) dielectric compound. FPNE materials can be achieved using a variety of cross-linking cross-linking, for example, pairs of acetylene compounds. Use of cross-linked FPNE manufactured electronic circuit does not produce polyimide materials, absorbent or solvent sensitive issues. FPNE show a good adhesion and low dielectric constant, almost free from the impact of increased humidity. FPNE has excellent high temperature performance, you can use certain additives to enhance performance. This material is produced using multi-layer electronic circuit were still using the traditional spin-coating process.Insulation Paper
FPNE manufactured using multi-layer electronic circuit has the following advantages: low power consumption, and improve the signal to noise ratio excellent solvent resistance layer and layer adhesion between the stronger and more reliable under high temperature and humid environments in the water solution is good low dielectric constant can be modified with additives, technical description of polyimide is a popular insulation material - with good mechanical properties and thermal properties. However, the moisture absorption properties of polyimide dielectric constant often lead to an increase thus affecting product performance. Moreover, some polyimide susceptible to hydrolysis by the solvent effects or chemical erosion. Ceramic Fiber. FPNE has good hydrolysis resistance and deep-agent nature of the wet environment remained very low dielectric constant, and has very good temperature performance.
Applications 1: for IC chips and the protection of dielectric coatings. Advantages: Avoid the impact of semiconductor devices rays generated by a soft error.
Application 2: The circuit board substrate (film or coating). Advantages: high temperature stability, solvent resistance, low dielectric constant.
Applications 3: used as a binder or resin, wire insulation material. Advantages: high-temperature stability and solvent resistance. 3 "technological advantage:
FPNE manufactured using multi-layer electronic circuit has the following advantages: low power consumption, and improve the signal to noise ratio excellent solvent resistance layer and layer adhesion between the stronger and more reliable under high temperature and humid environments in the water solution is good low dielectric constant can be modified with additives, technical description of polyimide is a popular insulation material - with good mechanical properties and thermal properties. However, the moisture absorption properties of polyimide dielectric constant often lead to an increase thus affecting product performance. Moreover, some polyimide susceptible to hydrolysis by the solvent effects or chemical erosion. FPNE has good hydrolysis resistance and deep-agent nature of the wet environment remained very low dielectric constant, and has very good temperature performance.
